Selection and application of silicone hot stamping plate
Time:2023-01-08
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The choice of silicone hot stamping plate
The hardness of the silicone layer of the existing hot stamping plate is above HS60, generally HS85±5. This is because if the hardness of the silica gel layer is too low, it is easy to deform under high temperature and high pressure, so that the shear force of the page on the electrochemical aluminum is not enough, thus affecting the hot stamping effect. Therefore, in general, the hardness of the silica gel layer selected should be greater than HS80.
With the increase of the hardness of silica gel layer, the resilience of silica gel layer will generally be affected by the shadow mouth, and the resilience is directly related to the effect of hot stamping, if the resilience of silica gel layer is not good, it will inevitably lead to the epitaxial edge of hot stamping, bonding is not strong. The appearance of rough edges and other phenomena. Therefore, in the choice of silicone stamping plate, resilience should be paid attention to.
In order to facilitate the installation of silicone hot stamping plate on the electric heating plate, the base of silicone hot stamping plate is generally selected with a thickness of 1-3mm aluminum plate. The bonding strength between the silicone layer and the aluminum plate is directly related to the service life of the silicone hot stamping plate. If the bonding strength between the silicone layer and the aluminum plate is not high enough, it is easy to crack under high temperature and high pressure. Therefore, the silica gel layer and aluminum plate should be selected between the bonding strength of high silica gel stamping plate.
With the increase of the hardness of silica gel layer, the resilience of silica gel layer will generally be affected by the shadow mouth, and the resilience is directly related to the effect of hot stamping, if the resilience of silica gel layer is not good, it will inevitably lead to the epitaxial edge of hot stamping, bonding is not strong. The appearance of rough edges and other phenomena. Therefore, in the choice of silicone stamping plate, resilience should be paid attention to.
In order to facilitate the installation of silicone hot stamping plate on the electric heating plate, the base of silicone hot stamping plate is generally selected with a thickness of 1-3mm aluminum plate. The bonding strength between the silicone layer and the aluminum plate is directly related to the service life of the silicone hot stamping plate. If the bonding strength between the silicone layer and the aluminum plate is not high enough, it is easy to crack under high temperature and high pressure. Therefore, the silica gel layer and aluminum plate should be selected between the bonding strength of high silica gel stamping plate.
Control of hot stamping process
1. Control of hot stamping temperatureTraditional anodized aluminum stamping plate selection of copper, zinc plate, due to the high thermal conductivity of copper and zinc, so the stamping temperature is generally 70-180 ℃. And silica gel stamping plate due to the surface of the silicone layer of low thermal conductivity, so hot stamping should be appropriate to improve the hot stamping temperature, under normal circumstances should be higher than copper, zinc stamping temperature 30-50 ℃. Of course, the better the thermal conductivity of the silicone layer, the lower the stamping temperature can be adjusted, the more energy can be saved. Therefore, in the choice of silicone hot stamping plate, should also choose better thermal conductivity of silicone hot stamping plate.
2. Control of hot stamping pressure
The surface of the silicone hot stamping plate uses a silicone layer with lower hardness, which has a certain elasticity and is more copper in the process of hot stamping. The zinc version compacts the electrochemical aluminum foil more easily. Therefore, to obtain the same stamping effect under the same conditions, the pressure used by the silicone stamping plate is less.
The surface of the silicone hot stamping plate uses a silicone layer with lower hardness, which has a certain elasticity and is more copper in the process of hot stamping. The zinc version compacts the electrochemical aluminum foil more easily. Therefore, to obtain the same stamping effect under the same conditions, the pressure used by the silicone stamping plate is less.
3. Control of hot stamping speed
Other things being equal, the elastic silicone scalding plate compacts the electrochemical aluminum foil in less time than the copper-zinc plate. So the same hot stamping effect, the new silicone hot stamping plate hot stamping faster.
Of course, in the actual operation of the above parameters are not set in stone, and to select and set according to the needs of the actual work, such as copper, zinc plate, uniform stamping pressure, lower stamping temperature and slower stamping speed will produce more ideal stamping effect, because uniform stamping pressure makes electrochemical aluminum bonding better, The lower stamping temperature makes the electrochemical aluminum gloss higher, and the slower stamping speed is to adapt to the lower stamping temperature.
In short, the silicone hot stamping plate for electrochemical aluminum stamping is a new type of hot stamping plate under development. There may be many other problems in the actual use process, which need to be further improved by scientific researchers and technicians.
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Anna Zhang